The innovation in the semiconductor industry is being shaped by accelerating chip complexity, rising demand for domain-specific AI silicon, and the push for optimized time-to-market. Companies are leveraging chip-to-cloud engineering, advanced reusable IP, and strategic collaborations with major chipmakers to deliver first-silicon success, greater reliability, and sustainable, high-performance products at scale. With next-gen solutions like AI-driven analytics, GenAI, and IoT reshaping industries, the emphasis has shifted towards fostering resilience, operational efficiency, and innovation. This transformation is redefining how industries like automotive, healthcare, telecom, and semiconductors innovate, collaborate, and deliver value.
At the forefront of this evolution are organizations that combine domain expertise, robust partner ecosystems, and cutting-edge technological capabilities. They are not just responding to industry changes but proactively shaping the future of engineering. LTTS delivers domain-specific solutions by embedding specialized Edge AI, automotive, and smart city expertise directly into silicon design. This vertical-first approach ensures our semiconductor solutions are optimized for real-world applications, linking advanced chip design to tangible system-level performance and creating more intelligent and efficient products. Our contributions in engineering innovation have earned the recognition as a Horizon 3 Leader in the HFS Horizons Report 2025. This acknowledgment reflects our dedication to ecosystem-level transformation, co-innovation, and the development of next-gen solutions that accelerate business success.
Key Achievements Highlighted in the Report:
- Chip-to-Cloud Engineering: Outstanding scores for domain expertise, transformation capabilities, and technology knowledge.
- Reusable IP and Reference Platforms: Recognized for extensive library of reusable IP, including SoC blocks, DFT IP, and test automation frameworks, accelerates development and ensures first-time silicon success.
- Collaborative Excellence: Celebrated for strong partnerships and delivering tailored, end-to-end industry solutions.
According to HfS, " LTTS stands out with true chip-to-cloud engineering through post-silicon validation, platform software, and system design. Its 3,600+ domain engineers, 15+ in-house labs, and reusable IP and reference platforms enable faster, more reliable silicon development. By co-engineering with leading CPU, GPU, and wireless chipmakers and embedding domain-led Edge AI and automotive expertise, LTTS helps enterprises build more sustainable, resilient, and efficient semiconductor products at scale.”
Partner with a leader that’s driving transformation across industries. Leverage our strengths in engineering innovation, sustainability integration, and cutting-edge technology to stay ahead in an evolving market landscape.
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