PACK EXPO International
L&T Technology Services participated in PACKExpo held in Chicago from November 2-5, 2014. PACKExpo focused on processing and packaging solutions while at the same time introduced technologies and ideas from different industries.
L&T Technology Services participated by way of a booth display. Our Process Industry related offerings were on display at the booth. Our team consisting of senior representatives were able to connect with the new leads as well as build strong connect with our existing clients.