5G for Semiconductors
From the 5G chipset to the cloud, LTTS helps drive an interconnected ecosystem, delivering significant benefits across the entire product value chain. As the IoT ecosystem semiconductors has become vitally important in driving business success in a connected ecosystem.The demand for reliable and high-performance semiconductor (semicon) chips has pushed the industry to accelerate its innovation efforts.
But the journey is not without its own unique challenges.
Technically, typical 5G semiconductor engineering has been built around telecom or communication-focused architecture. The change in infrastructure from standalone to cloud-native format has resulted in the 5G enabled chipsets to become more server oriented. For the industry, this marks a fundamental shift in technology. High performance computing and solutions to support the server requirements of a data center model has emerged as the need of the hour.
5G for Semicon
LTTS Offerings
Our industry-leading semicon offerings follow a “spec to system” model. It starts with the overall 5G system specifications to define server stacks all the way to mapping your overall architecture to the business infrastructure. With protracted developmental efforts into both the device and large-scale infrastructural implementation, LTTS leverages its partnerships with major players in the 5G industry to ensure that businesses have 360-degree access to the expertise, resources, and support required to facilitate a seamless 5G transition.
With high-performance semicons and 5G chipsets today forming the building blocks for enterprise expansion, LTTS offer a wide range of solutions and support services including:
VLSI
System Design
Platform Software and Middleware
Emulation and PSV
Connectivity/Modems
Lab as a Service
Test Automation
Platform Validation
Value Delivered
LTTS deep domain expertise and industry-leading partnerships has helped drive the evolution of server-based 5G chipsets that can seamlessly meet high-performance and infrastructure-heavy requirements. Our AI/ML-enabled solutions backed by platform engineering capabilities that ensure an accurate fit for your enterprise systems, are capable of supporting hybrid workloads in a dynamic technology landscape. Our end-to-end chip design expertise helps facilitate:
Product Conceptualization
Design and Development
Testing and Clarification
Manufacturing Capabilities
Product Launch Support
Product Maintenance
LTTS “chip-to-cloud” mentality ensures that our product engineering connects back into singular devices or wholesale enterprise infrastructure as needed. From 5G for semiconductors to systems, our focused service offerings can scale to support your needs far better than other boutique communication service providers. With our managed service solutions in place, you are guaranteed:
- Optimized development time / faster time to market
- L&TTS’s knowledge base and 5G test lab expertise
- Cost-effective partnership in carrier customization and certification
The LTTS Edge
LTTS has a strong understanding of the application of technology across different domains of engineering services. This allows us to cut down time-to-market for 5G implementation in respective domains. Furthermore, our on-board specialized teams provide the necessary integration for these systems and embrace the benefits of the industry’s growth.
Driven by our “spec to system” ethos, we have adopted the following process for developing, deploying and managing our 5G for semiconductors portfolio:
End-to-End
Services
- 1
VLSI
- 2
Platform Software
- 3
Platform Software
- 4
Verification
& Validation
Multi-Million
Gate Designs
Long-Standing
Partnership with
Tier-1 SoCs
State-of-the-art
labs
Multi-Vertical
Expertise
- Spec to GDSII Dev
- Spec to GDSII Dev
- Spec to GDSII Dev
- Front-End Dev
- Back-end Dev
- Android, Linux Platform Engineering
- Windows Platform Engineering
- Customer Engineering
- Board Support Package
- Device Driver Dev
- Application SW
- Board Dev
- Proto Manufacturing
- FPGA Design & Validation
- SI/PI analysis
- Pre-Certification (EMI/EMC, RF, Thermal)
- Component Engineering
- Field Testing
- Modem stack testing
- Platform testing
- Lab as a service
- Connectivity (Wi-Fi, BT) testing
- Automation
- Pre-certification
- Inter-Op testing
Our Key Differentiators
