Chips with 3D Imaging & Depth Perception
We enabled microchips with advanced sensing capabilities to achieve depth perception and 3D imaging analysis that can be used for various applications.
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We successfully enabled complete physical design and verification of image processing SoC using a low power methodology
Futuristic solutions and IP cores that address the most pressing needs of the semiconductor industry
Our IC designs in some areas involving wireless mesh networks & connected drones are revolutionizing the semiconductor market